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Association Connecting Electronics Industries, 08/01/2021
Publisher: IPC
File Format: PDF
$75.00$150.00
Published:01/08/2021
Pages:60
File Size:1 file , 1.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document provides guidelines for establishing a best practice methodology for use in developing a formal DFX (Design for Manufacturing, Fabrication, Assembly, Testability, Cost, Reliability, Environment, Reuse) process for layout of printed board assemblies that utilize surface mount and through hole devices.
Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures
$91.00 $182.00
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
$84.00 $168.00
Guidelines for Design, Selection and Application of Conformal Coatings
Solderability Tests for Printed Boards
