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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/10/2022
Pages:56
File Size:1 file , 3.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates. Flexible substrates, as pertain to this standard, are materials, devices or functionalized circuitry which have some amount of flexibility or bendability (not rigid) but are not considered to be stretchable.
Specification for Immersion Tin Plating for Printed Circuit Boards with Amendment 1
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Microwave End Product Board Inspection and Test
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Sectional Design Standard for Flexible Printed Boards
Surface Mount Placement Equipment Characterization