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Association Connecting Electronics Industries, 07/01/2003
Publisher: IPC
File Format: PDF
$65.00$130.00
Published:01/07/2003
Pages:32
File Size:1 file , 1.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Technical Proceedings for the Designers Learning Symposium - 2001
$57.00 $114.00
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
$71.00 $142.00
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
$50.00 $101.00
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
$43.00 $86.00