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Association Connecting Electronics Industries, 11/01/2001
Publisher: IPC
File Format: PDF
$43.00$86.00
Published:01/11/2001
Pages:14
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$50.00 $101.00
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
$51.00 $103.00