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Association Connecting Electronics Industries, 11/01/2001
Publisher: IPC
File Format: PDF
$43.00$86.00
Published:01/11/2001
Pages:14
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
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Selection and Application of Board Level Underfill Materials
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Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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