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Association Connecting Electronics Industries, 12/01/2021
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/12/2021
Pages:60
File Size:1 file , 3.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies - automated, semiautomated and manual - and is applicable to related mechanical assembly and transactional processes.
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
$86.00 $173.00
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
$48.00 $97.00
Metal Foil for Printed Board Applications
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
$50.00 $101.00
