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Association Connecting Electronics Industries, 07/01/2022
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/07/2022
Pages:64
File Size:1 file , 3.3 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies - automated, semiautomated and manual - and is applicable to related mechanical assembly and transactional processes.
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
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Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
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Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
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Connected Factory Exchange (CFX)
