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Association Connecting Electronics Industries, 03/01/2023
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/03/2023
Pages:72
File Size:1 file , 2.8 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies – automated, semiautomated and manual – and is applicable to related mechanical assembly and transactional processes.&*+
Specification for Base Materials for Rigid and Multilayer Printed Boards with Amendment 1
$91.00 $182.00
Application Categories for Printed Electronics
$50.00 $101.00
White Paper on Conflict Minerals Due Diligence Guidance
$48.00 $97.00
Specification for Base Materials for Rigid and Multilayer Printed Boards
$90.00 $180.00
