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Association Connecting Electronics Industries, 03/01/2023
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/03/2023
Pages:72
File Size:1 file , 2.8 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. This standard applies to communication between all executable processes in the manufacture of printed board assemblies – automated, semiautomated and manual – and is applicable to related mechanical assembly and transactional processes.&*+
Specifications for High Density Interconnect (HDI) and Microvia Materials
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Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
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Semiconductor Design Standard for Flip Chip Applications
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Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
