IPC 4101C

Specification for Base Materials for Rigid and Multilayer Printed Boards

Association Connecting Electronics Industries, 08/01/2009

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/08/2009

Pages:140

File Size:1 file , 940 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification covers the requirements for base materials that are referred to as laminate or prepreg. These are to be used primarily for rigid and multilayer printed boards for electrical and electronic circuits. This document contains 66 individual specification sheets that can be searched using key words. These key words allow the document's user to find materials of a similar nature, but with specific differing properties that fine-tune their laminate and/or prepreg selection needs. This revision's 11 new specification sheets reflect the expanded offerings for current commercially available laminates and prepregs. These 11 new specification sheets add laminate and prepreg materials to this document that have improved or additional properties that include one or more of the following: low halogen content, lead-free applications, high thermal performance or high speed/high frequency performance.

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