• IPC 4103

IPC 4103

Specification for Base Materials for High Speed/High Frequency Applications

Association Connecting Electronics Industries, 01/01/2002

Publisher: IPC

File Format: PDF

$67.00$135.00


Published:01/01/2002

Pages:41

File Size:1 file , 410 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Covers the requirements for high speed / high frequency laminate or bonding layers to be used primarily for the fabrication of rigid or multilayer printed boards for high speed / high frequency electrical and electronic circuits. Some of the improvements over the IPC-L-125A specification include updated bonding layer testing parameters, inspection lot requirements, revised visual acceptance criteria, and new specification sheets for hydrocarbon and polyester resin systems. Supersedes IPC-L-125A.

More IPC standard pdf

IPC 6012DA-WAM1

IPC 6012DA-WAM1

Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards

$51.00 $103.00

IPC WP-019A

IPC WP-019A

White Paper on Global Change in Ionic Cleanliness Requirements

$49.00 $99.00

IPC J-STD-001G - Amendment

IPC J-STD-001G - Amendment

Requirements for Soldered Electrical and Electronic Assemblies

$43.00 $87.00

IPC PERM-WP-022

IPC PERM-WP-022

White Paper on Mitigation of Pure Tin Risk by Tin-Lead SMT Reflow - Results of an Industry Round-Robin - Final Report

$29.00 $58.00