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Association Connecting Electronics Industries, 01/01/2014
Publisher: IPC
File Format: PDF
$71.00$142.00
Published:01/01/2014
Pages:68
File Size:1 file , 670 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
$71.00 $142.00
Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies
$50.00 $101.00
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00