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Association Connecting Electronics Industries, 05/01/1999
Publisher: IPC
File Format: PDF
$71.00$142.00
Published:01/05/1999
Pages:100
File Size:1 file , 440 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specifications for High Density Interconnect (HDI) and Microvia Materials
$71.00 $142.00
Specification for Finished Fabric Woven from "E" Glass for Printed Boards
$48.00 $97.00
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
$67.00 $135.00
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Flexible Base Dielectrics for Use in Flexible Printed Circuitry