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Association Connecting Electronics Industries, 05/01/1999
Publisher: IPC
File Format: PDF
$71.00$142.00
Published:01/05/1999
Pages:100
File Size:1 file , 440 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specifications for High Density Interconnect (HDI) and Microvia Materials
$71.00 $142.00
Stencil Design Guidelines
$50.00 $101.00
Spherical Bend Test Method for Characterization of Board Level Interconnects
$86.00 $173.00
Design and Assembly Process Implementation for Bottom Termination Components
$91.00 $182.00
Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials