IPC 4203B

Cover and Bonding Material for Flexible Printed Circuitry

Association Connecting Electronics Industries, 03/01/2018

Publisher: IPC

File Format: PDF

$74.00$148.00


Published:01/03/2018

Pages:52

File Size:1 file , 560 KB

Note:This product is unavailable in Russia, Belarus

IPC 4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides. These materials are to be used as cover material for flexible printed circuitry as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. The standard does not address nonflexible adhesives designed to be used in the rigid board areas of rigid flex constructions which are addressed in IPC-4101. Materials such as liquid-applied covercoat are delineated in IPC-SM-840 and are excluded from this document. The requirements herein meet or exceed the requirements for Class 3 which, in turn, meet or exceed conformance to Classes 1 and 2.

More IPC standard pdf

IPC SM-840D

IPC SM-840D

Qualification and Performance Specification of Permanent Solder Mask

$34.00 $69.00

IPC DR-572A

IPC DR-572A

Drilling Guidelines for Printed Boards

$50.00 $101.00

IPC 5702

IPC 5702

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

$50.00 $101.00

IPC 2316

IPC 2316

Design Guide for Embedded Passive Device Printed Boards

$91.00 $182.00