Your shopping cart is empty!
Association Connecting Electronics Industries, 03/01/2001
Publisher: IPC
File Format: PDF
$17.00$35.00
Published:01/03/2001
Pages:12
File Size:1 file , 29 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
$65.00 $130.00
Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
$43.00 $86.00
Moisture Sensitivity Classification for Non-IC Components
$31.00 $63.00
PWB Assembly Soldering Process Guideline for Electronic Components
$50.00 $101.00