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Association Connecting Electronics Industries, 06/01/2012
Publisher: IPC
File Format: PDF
$109.00$218.26
Published:01/06/2012
Pages:4
File Size:1 file , 34 KB
Note:This product is unavailable in Russia, Belarus
Dimensional Stability Testing of Thin Laminates-Report on Phase I and Phase II International Round Robin Test Programs - Includes addenda I and II
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Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
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Guidelines for Chip-on-Board Technology Implementation
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Guidelines for Molded Interconnection Devices
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