Your shopping cart is empty!
PDF Preview
Association Connecting Electronics Industries, 07/27/2021
Publisher: IPC
File Format: PDF
$108.00$216.00
Published:27/07/2021
Pages:156
File Size:1 file , 7.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
$50.00 $101.00
Standard for Determining Current Carrying Capacity in Printed Board Design
$91.00 $182.00
Cleanliness Requirements for Unpopulated Printed Boards
Specification for Base Materials for Rigid and Multilayer Printed Boards
