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Association Connecting Electronics Industries, 07/27/2021
Publisher: IPC
File Format: PDF
$108.00$216.00
Published:27/07/2021
Pages:156
File Size:1 file , 7.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will meet the highest coating durability rating as specified in IPC-J-STD-003 printed board solderability specification.
Requirements and Acceptance for Cable and Wire Harness Assemblies with Amendment 1
$86.00 $173.00
Amendment 1 to Specification for Immersion Tin Plating for Printed Circuit Boards
$112.00 $225.55
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
$91.00 $182.00
Declaration Requirements for Shipping, Pack and Packing Materials.
$30.00 $60.00
