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Association Connecting Electronics Industries, 04/01/2022
Publisher: IPC
File Format: PDF
$59.00$119.00
Published:01/04/2022
Pages:24
File Size:1 file , 990 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
$50.00 $101.00
Design Guide for Embedded Passive Device Printed Boards
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Solderability Tests for Printed Boards
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Generic Requirements for Surface Mount Land Pattern and Design Standard - INCLUDES LAND PATTERN VIEWER SOFTWARE
$70.00 $140.00
