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IPC 4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards

Association Connecting Electronics Industries, 04/01/2022

Publisher: IPC

File Format: PDF

$59.00$119.00


Published:01/04/2022

Pages:24

File Size:1 file , 990 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).

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