Your shopping cart is empty!
Association Connecting Electronics Industries, 05/01/2008
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/05/2008
Pages:32
File Size:1 file , 340 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$50.00 $101.00
Cover and Bonding Material for Flexible Printed Circuitry
$74.00 $148.00
Design and Assembly Process Implementation for Flip Chip and Die-Size Components
$91.00 $182.00
Terms and Definitions for the Design and Manufacture of Printed Electronics (Additive Circuitry)
$51.00 $103.00