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Association Connecting Electronics Industries, 01/01/2010
Publisher: IPC
File Format: PDF
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Published:01/01/2010
File Size:1 file , 1.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
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Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
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Acceptability of Electronic Assemblies on CD-ROM
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Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials