IPC 6013D

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards

Association Connecting Electronics Industries, 09/01/2017

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/09/2017

Pages:80

File Size:1 file , 3 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

The IPC-6013D covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. IPC-6013D incorporates new and updated requirements for final finishes, rigid-to-flex transition zones, deformation anomalies including wrinkles, creases and soda strawing, marking, registration (annular ring), conductor thickness reductions, dielectric removal in holes, resin smear, copper filled microvias and selective (button) hole plating.

More IPC standard pdf

IPC SM-840E

IPC SM-840E

Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials

$50.00 $101.00

IPC CH-65B

IPC CH-65B

Guidelines for Cleaning of Printed Boards and Assemblies

$91.00 $182.00

IPC 1071

IPC 1071

Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing

$48.00 $97.00

IPC 2222A

IPC 2222A

Sectional Design Standard for Rigid Organic Printed Boards

$71.00 $142.00