• IPC 6015

IPC 6015

Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures

Association Connecting Electronics Industries, 02/01/1998

Publisher: IPC

File Format: PDF

$50.00$101.00


Published:01/02/1998

Pages:25

File Size:1 file , 1.2 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification establishes the specific requirements for organic mounting structures used to interconnect chip components, which in combination form the completed functional organic single-chip module (SCM-L) or organic multichip module (MCM-L) assembly and the quality and reliability assurance requirements that must be met for their acquisition. For use with IPC-6011.

More IPC standard pdf

IPC TR-466

IPC TR-466

Technical Report: Wetting Balance Standard Weight Comparison Test

$43.00 $86.00

IPC D-325A

IPC D-325A

Documentation Requirements for Printed Boards

$71.00 $142.00

IPC 9501

IPC 9501

PWB Assembly Process Simulation for Evaluation of Electronic Components

$50.00 $101.00

IPC CA-821

IPC CA-821

General Requirements for Thermally Conductive Adhesives

$50.00 $101.00