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Association Connecting Electronics Industries, 08/01/2021
Publisher: IPC
File Format: PDF
$51.00$102.00
Published:01/08/2021
Pages:28
File Size:1 file , 880 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
$91.00 $182.00
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
$48.00 $97.00
Generic Requirements for Surface Mount Design and Land Pattern Standard
