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Association Connecting Electronics Industries, 02/01/2022
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/02/2022
Pages:60
File Size:1 file , 2.7 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.
The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages
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Printed Wiring Board Strain Gage Test Guideline
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Requirements for Soldered Electrical and Electronic Assemblies
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