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Association Connecting Electronics Industries, 08/01/2022
Publisher: IPC
File Format: PDF
$13.00$27.00
Published:01/08/2022
Pages:20
File Size:1 file , 1.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This addendum provides requirements to be used in addition to, and in some cases, in place of, those published in IPC-6018D to ensure the reliability of printed boards that must survive the vibration, ground testing, and thermal cycling environments of space and military avionics.
Reflow Oven Process Control Standard
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Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Monotonic Bend Characterization of Board-Level Interconnects with Amendment 1
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Design and Assembly Process Implementation for Embedded Components