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IPC 7091

Design and Assembly Process Implementation of 3D Components

Association Connecting Electronics Industries, 06/01/2017

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/06/2017

Pages:108

File Size:1 file , 5.3 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

The IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements?some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components? substrate structure.

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