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Association Connecting Electronics Industries, 01/01/2023
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/01/2023
Pages:104
File Size:1 file , 7.8 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single-package format can impact individual component characteristics and can dictate suitable assembly methodology. The information contained in this standard focuses on achieving optimum functionality, process assessment, end-product reliability and repair issues associated with 3D semiconductor package assembly and processing.
$310.00 $621.00
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
$115.00 $231.05
Sectional Requirements for Implementation of Bare-Board Product Testing Data Description
$43.00 $86.00
Sectional Requirements for Implementation of Assembly In-Circuit Test Data Description