IPC 7092A

Design and Assembly Process Implementation for Embedded Components

Association Connecting Electronics Industries, 10/01/2022

Publisher: IPC

File Format: PDF

$90.00$181.00

Description

Published:01/10/2022

Pages:124

File Size:1 file , 8.2 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.

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