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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$90.00$181.00
Published:01/10/2022
Pages:124
File Size:1 file , 8.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.
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