Your shopping cart is empty!
PDF Preview
Association Connecting Electronics Industries, 05/01/2023
Publisher: IPC
File Format: PDF
$85.00$170.00
Published:01/05/2023
Pages:56
File Size:1 file , 5.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document provides generic guidelines on land pattern geometries used for the attachment of electronic components to a printed board, as well as design recommendations for achieving the best possible solder joints to the devices assembled.
Adjustments to the information in this guideline may be required to meet company and/or board technology requirements. It is recommended that a company should document the modifications to the IPC-7352 content in corporate command media documentation.
A land pattern is the representation of the area and features on a printed board needed for a component to be placed and attached to the printed board during an assembly process. The land pattern is usually built using ECAD Library tools.
Materials Declaration Management with Amendments 1 & 2
$59.00 $118.00
Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
$71.00 $142.00
Selection and Application of Board Level Underfill Materials
$91.00 $182.00
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
