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  • IPC 7525A

IPC 7525A

Stencil Design Guidelines

Association Connecting Electronics Industries, 02/01/2007

Publisher: IPC

File Format: PDF

$48.00$97.00


Published:01/02/2007

Pages:28

File Size:1 file , 800 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

Now includes support for stencils used with lead free processes.

This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.

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