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IPC 7525B

Stencil Design Guidelines

Association Connecting Electronics Industries, 10/01/2011

Publisher: IPC

File Format: PDF

$48.00$97.00


Published:01/10/2011

Pages:36

File Size:1 file , 2.1 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.

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