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Association Connecting Electronics Industries, 06/01/2001
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/06/2001
Pages:24
File Size:1 file , 120 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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Design and Assembly Process Implementation for BGAs
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Specification for Finished Fabric Woven from "E" Glass for Printed Boards - Amendment 2
$15.00 $30.00
Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
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Handbook and Guide to IPC-D-620 and IPC/WHMA-A-620
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