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IPC 7621

Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics

Association Connecting Electronics Industries, 01/01/2018

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/01/2018

Pages:40

File Size:1 file , 2.7 MB

Note:This product is unavailable in Russia, Belarus

Encapsulation, for the purpose of IPC 7621, is defined as a low pressure molded thermoplastic, e.g., polyamide, which is brought to a liquid state and injection molded and (rather quickly) returned to a temperature below its melting point, forming a durable yet pliable (rubbery-like) form. The desired performance characteristics of LPM encapsulation depend on the application and must be considered when selecting material. Users are urged to consult material suppliers for detailed technical data. This guide will aid the user in understanding the capabilities and limits of LPM using thermoplastics.

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