IPC 7711/7721C

Rework, Modification and Repair of Electronic Assemblies

Association Connecting Electronics Industries, 01/01/2017

Publisher: IPC

File Format: PDF

$187.00$375.00

Description

Published:01/01/2017

Pages:396

File Size:1 file , 13 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This guide provides procedures for rework, repair and modification of printed board assemblies. Included in this revision are the procedures previously released as change pages, an updated general information and common procedures section, new procedures for BGAs using focused IR Reflow Systems with integral preheater and general updates to all other procedures. Color illustrations are included in many procedures.

More IPC standard pdf

IPC DLS-2001

Technical Proceedings for the Designers Learning Symposium - 2001

$57.00 $114.00

IPC TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

$71.00 $142.00

IPC 7530

Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

$50.00 $101.00

IPC 2516A

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description

$43.00 $86.00