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Association Connecting Electronics Industries, 12/01/2022
Publisher: IPC
File Format: PDF
$85.00$170.00
Published:01/12/2022
Pages:56
File Size:1 file , 2.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to this standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile).
Coated or treated textile substrates, as pertain to this standard, are textile substrates which have or will have a coating or treatment localized or across the full substrate.
Acceptability of Electronic Assemblies
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Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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Qualification and Performance Specification for Rigid Printed Boards - Amendment 1
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