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Association Connecting Electronics Industries, 12/01/2022
Publisher: IPC
File Format: PDF
$85.00$170.00
Published:01/12/2022
Pages:56
File Size:1 file , 2.6 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to this standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile).
Coated or treated textile substrates, as pertain to this standard, are textile substrates which have or will have a coating or treatment localized or across the full substrate.
Generic requirements for implementation of product manufacturing description data and transfer methodology
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Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments
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Sectional Requirements for Supply Chain Communication of Bill of Material and Product Design Configuration Data - Product Data eXchange