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Association Connecting Electronics Industries, 11/01/1999
Publisher: IPC
File Format: PDF
$71.00$142.00
Published:01/11/1999
File Size:1 file , 700 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Specifications for High Density Interconnect (HDI) and Microvia Materials
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Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
$43.00 $86.00
Semiconductor Design Standard for Flip Chip Applications
$65.00 $130.00
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps