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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/10/2022
Pages:20
File Size:1 file , 1.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Data eXchange (PDX)
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Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, with Amendment 1
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Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description
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