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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/10/2022
Pages:20
File Size:1 file , 1.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
Supporting Data and Numerical Examples for ANSI./J-STD-001B: Appendix D (Control of Fluxes)
$50.00 $101.00
Implementation of Ball Grid Array and Other High Density Technology
$71.00 $142.00
Generic Performance Specification for Printed Boards
$48.00 $97.00
Evaluation of Steam Aging on Alternative Finishes, Phase 11A
