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Association Connecting Electronics Industries, 10/01/2022
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/10/2022
Pages:20
File Size:1 file , 1.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Device
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Qualification and Performance Specification for Rigid Printed Boards, Includes Amendment 1
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Acceptability of Printed Boards
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Sectional Design Standard for Flexible Printed Boards
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