IPC 9500-K

Assembly Process Component Simulations, Guidelines and Classifications Package

Association Connecting Electronics Industries, 03/01/2003

Publisher: IPC

File Format: PDF

$112.00$225.00

Description

Published:01/03/2003

Pages:79

Note:This product is unavailable in Russia, Ukraine, Belarus

Here's a convenient and cost effective way to own the complete set of process simulation documents for component attachment. This set of four documents, 9501-9504, contains the information you need to help you select components that will be compatible with your assembly process. Learn about manufacturing solder process limits, moisture sensitivity classifications, preconditioning and conformal coatings, surface mount and through assembly process simulations.

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