• IPC 9631

IPC 9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

Association Connecting Electronics Industries, 12/01/2010

Publisher: IPC

File Format: PDF

$91.00$182.00


Published:01/12/2010

Pages:24

File Size:1 file , 1.1 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.

More IPC standard pdf

IPC A-43-K

IPC A-43-K

Ten-Layer Multi Artwork - Kit

$297.00 $594.00

IPC J-STD-075A

IPC J-STD-075A

Classification of Non-IC Electronic Components for Assembly Processes

$51.00 $103.00

IPC A-47

IPC A-47

Composite Test Pattern Ten-Layer Phototool

$162.00 $324.00

IPC CD-30/31

IPC CD-30/31

CD: Microsection Evaluation Training

$256.00 $513.00