• Your shopping cart is empty!

PDF Preview

IPC 9701B

Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments

Association Connecting Electronics Industries, 02/01/2022

Publisher: IPC

File Format: PDF

$51.00$102.00


Published:01/02/2022

Pages:24

File Size:1 file , 1 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.

More IPC standard pdf

IPC SM-840E

IPC SM-840E

Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials

$50.00 $101.00

IPC CH-65B

IPC CH-65B

Guidelines for Cleaning of Printed Boards and Assemblies

$91.00 $182.00

IPC 1071

IPC 1071

Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing

$48.00 $97.00

IPC 2222A

IPC 2222A

Sectional Design Standard for Rigid Organic Printed Boards

$71.00 $142.00