Your shopping cart is empty!
PDF Preview
Association Connecting Electronics Industries, 02/01/2022
Publisher: IPC
File Format: PDF
$51.00$102.00
Published:01/02/2022
Pages:24
File Size:1 file , 1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
Implementation of Flip Chip and Chip Scale Technology
$91.00 $182.00
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
$32.00 $65.00
Requirements for Soldered Electrical and Electronic Assemblies
$80.00 $160.00
Design and End Product Requirements for Discrete Wiring Boards
$71.00 $142.00