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Association Connecting Electronics Industries, 02/01/2022
Publisher: IPC
File Format: PDF
$51.00$102.00
Published:01/02/2022
Pages:24
File Size:1 file , 1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry
$51.00 $102.00
Connected Factory Exchange (CFX)
$91.00 $182.00
Qualification and Performance Specification for Printed Electronics on Flexible Substrates
$74.00 $148.00
Requirements for Electrical Testing of Flexible Printed Electronics
