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Association Connecting Electronics Industries, 02/01/2022
Publisher: IPC
File Format: PDF
$51.00$102.00
Published:01/02/2022
Pages:24
File Size:1 file , 1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
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