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Association Connecting Electronics Industries, 07/01/2002
Publisher: IPC
File Format: PDF
$86.00$173.00
Published:01/07/2002
Pages:68
File Size:1 file , 1.7 MB
Note:This product is unavailable in Russia, Belarus
Sectional Design Standard for Rigid Organic Printed Boards
$71.00 $142.00
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
$91.00 $182.00
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
$48.00 $97.00