IPC A-20/21-GKIT

Standard Pitch Stencil Pattern for Slump Evaluation (Electronic Gerber Files)

Association Connecting Electronics Industries,

Publisher: IPC

File Format: PDF

$81.00$162.00

Description

Note:This product is unavailable in Russia, Ukraine, Belarus

Provided electronically, these Gerber Files include patterns for developing solder paste stencils by lasar or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump.

IPC A-20/21-GKIT history

IPC A-20/21-GKIT

Standard Pitch Stencil Pattern for Slump Evaluation (Electronic Gerber Files)

$81.00 $162.00

More IPC standard pdf

IPC 2224

Standard for Design of Printed Wiring Boards for PCMCIAs

$71.00 $142.00

IPC 4101

Specifications for Base Materials for Rigid and Multilayer Printed Boards

$86.00 $173.00

IPC FC-234

Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Printed Circuits

$48.00 $97.00

IPC PE-740A

Troubleshooting Guide for Printed Board Manufacture and Assembly

$91.00 $182.00