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Association Connecting Electronics Industries, 03/01/1996
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/03/1996
Pages:18
File Size:1 file , 140 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Spherical Bend Test Method for Characterization of Board Level Interconnects
$86.00 $173.00
Design and Assembly Process Implementation for Bottom Termination Components
$91.00 $182.00
Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials
$50.00 $101.00
Guidelines for Cleaning of Printed Boards and Assemblies