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Association Connecting Electronics Industries,
Publisher: IPC
File Format: PDF
$38.00$76.00
Note:This product is unavailable in Russia, Ukraine, Belarus
Single Sided Artwork - Kit
$38.00 $76.00
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
$71.00 $142.00
Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
$50.00 $101.00
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
$43.00 $86.00
Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
$17.00 $35.00
