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Association Connecting Electronics Industries,
Publisher: IPC
File Format: PDF
$177.00$355.00
Note:This product is unavailable in Russia, Ukraine, Belarus
Specification and Characterization Methods for Nonwoven "E" Glass Materials
$50.00 $101.00
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
Assembly Process Simulation for Evaluation of Non-IC Components (Preconditioning Non-IC Components)
$48.00 $97.00
Sectional Design Standard for Organic Multichip Modules (MCML & MCM-L Assemblies)
$71.00 $142.00