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Association Connecting Electronics Industries, 10/01/1996
Publisher: IPC
File Format: PDF
$168.00$337.00
Published:01/10/1996
Implementation of Flip Chip and Chip Scale Technology
$91.00 $182.00
Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules
$32.00 $65.00
Requirements for Soldered Electrical and Electronic Assemblies
$80.00 $160.00
Design and End Product Requirements for Discrete Wiring Boards
$71.00 $142.00
