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Association Connecting Electronics Industries, 01/01/2000
Publisher: IPC
File Format: PDF
$80.00$160.00
Published:01/01/2000
Pages:372
File Size:1 file , 6.7 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
$91.00 $182.00
Test Methods for Characterization of Printed Board Assembly Pad Cratering
Printed Board Handling and Storage Guidelines
$48.00 $97.00
Generic Requirements for Surface Mount Design and Land Pattern Standard