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Association Connecting Electronics Industries, 01/01/1995
Publisher: IPC
File Format: PDF
$50.00$101.00
Published:01/01/1995
Pages:18
File Size:1 file , 140 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
General Requirements for Thermally Conductive Adhesives
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Qualification & Performance Specification for Organic Multichip Module Mounting and Interconnecting Structures
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies
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Acceptability of Electronic Assemblies on CD-ROM
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Qualification of Facilities That Inspect / Test Printed Boards, Components and Materials