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Association Connecting Electronics Industries, 07/01/2011
Publisher: IPC
File Format: PDF
$91.00$182.00
Published:01/07/2011
Pages:216
File Size:1 file , 3.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
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Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices
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Moisture Sensitivity Classification for Non-IC Components
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PWB Assembly Soldering Process Guideline for Electronic Components
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