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Association Connecting Electronics Industries, 09/01/1984
Publisher: IPC
File Format: PDF
$48.00$97.00
Published:01/09/1984
Pages:14
File Size:1 file , 84 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
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Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes
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Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description
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Specification and Characterization Methods for Non-Woven Para-aramid Reinforcement, Amendment 1
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