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Association Connecting Electronics Industries, 07/01/2022
Publisher: IPC
File Format: PDF
$85.00$171.00
Published:01/07/2022
Pages:92
File Size:1 file , 3.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard defines the set of specification elements for components and parts to be assembled and connected onto printed boards. These specification elements mainly cover the component specifications in strong correlation with board-level manufacturing (e.g., SMT, THT, Press-Fit), assembly and board-level reliability.
General Electronic Components Model Based Definition (MBD) Standard
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Specification for Base Materials for High Speed/High Frequency Applications with Amendment 1
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Selection and Application of Board Level Underfill Materials
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Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
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