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Association Connecting Electronics Industries, 07/01/2022
Publisher: IPC
File Format: PDF
$85.00$171.00
Published:01/07/2022
Pages:92
File Size:1 file , 3.9 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This standard defines the set of specification elements for components and parts to be assembled and connected onto printed boards. These specification elements mainly cover the component specifications in strong correlation with board-level manufacturing (e.g., SMT, THT, Press-Fit), assembly and board-level reliability.
General Electronic Components Model Based Definition (MBD) Standard
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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications - Amendment 1
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Acceptability of Electronic Assemblies
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Guideline Methodology for Assessing Component and Cleaning Materials Compatibility
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Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
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