• IPC DD-135

IPC DD-135

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

Association Connecting Electronics Industries, 08/01/1995

Publisher: IPC

File Format: PDF

$32.00$65.00


Published:01/08/1995

Pages:36

File Size:1 file , 370 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard has been written for deposited organic interlayer dielectric materials under evaluation for MCM-D applications. The standard and test methods have been written without bias towards any particular class of materials.

IPC DD-135 history

IPC DD-135

IPC DD-135

Qualification for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

$32.00 $65.00

More IPC standard pdf

IPC TP-1114

IPC TP-1114

The Layman's Guide to Qualifying a Process to J-STD-001

$43.00 $87.00

IPC 2224

IPC 2224

Standard for Design of Printed Wiring Boards for PCMCIAs

$71.00 $142.00

IPC 4101

IPC 4101

Specifications for Base Materials for Rigid and Multilayer Printed Boards

$86.00 $173.00

IPC FC-234

IPC FC-234

Pressure Sensitive Adhesives Assembly Guidelines for Single-Sided and Double-Sided Printed Circuits

$48.00 $97.00